microelectromechanical system

      mechanical parts and electronic circuits combined to form miniature devices, typically on a semiconductor chip, with dimensions from tens of micrometres to a few hundred micrometres (millionths of a metre). Common applications for MEMS include sensors, actuators, and process-control units.

      Interest in creating MEMS grew in the 1980s, but it took nearly two decades to establish the design and manufacturing infrastructure needed for their commercial development. One of the first products with a large market was the automobile air-bag controller, which combines inertia sensors to detect a crash and electronic control circuitry to deploy the air bag in response. Another early application for MEMS was in inkjet printheads. In the late 1990s, following decades of research, a new type of electronic projector was marketed that employed millions of micromirrors, each with its own electronic tilt control, to convert digital signals into images that rival the best traditional television displays. Emerging products include mirror arrays for optical switching in telecommunications, semiconductor chips with integrated mechanical oscillators for radio-frequency applications (such as cellular telephones), and a broad range of biochemical sensors for use in manufacturing, medicine, and security.

      MEMS are fabricated by using the processing tools and materials employed in integrated-circuit (integrated circuit) (IC) manufacturing. Typically, layers of polycrystalline silicon are deposited along with so-called sacrificial layers of silicon dioxide or other materials. The layers are patterned and etched before the sacrificial layers are dissolved to reveal three-dimensional structures, including microscopic cantilevers, chambers, nozzles, wheels, gears, and mirrors. By building these structures with the same batch-processing methods used in IC manufacturing, with many MEMS on a single silicon wafer, significant economies of scale have been achieved. Also, the MEMS components are in essence “built in place,” with no subsequent assembly required, in contrast to the manufacture of conventional mechanical devices.

      A technical issue in MEMS fabrication concerns the order in which to build the electronic and mechanical components. High-temperature annealing is needed to relieve stress and warping of the polycrystalline-silicon layers, but it can damage any electronic circuits that have already been added. On the other hand, building the mechanical components first requires protecting these parts while the electronic circuitry is fabricated. Various solutions have been used, including burying the mechanical parts in shallow trenches prior to the electronics fabrication and then uncovering them afterward.

      Barriers to further commercial penetration of MEMS include their cost compared with the cost of simpler technologies, nonstandardization of design and modeling tools, and the need for more reliable packaging. A current research focus is on exploring properties at nanometre (nanotechnology) dimensions (i.e., at billionths of a metre) for devices known as nanoelectromechanical systems (NEMS). At these scales the frequency of oscillation for structures increases (from megahertz up to gigahertz frequencies), offering new design possibilities (such as for noise filters); however, the devices become increasingly sensitive to any defects arising from their fabrication.

S. Tom Picraux

 

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